On November 26, 2024, Intel Connection was held in Chengdu. As a strategic partner of Intel, iSoftStone and its subsidiary, MECHREVO, were invited to attend. Intel, Zhipu AI, and MECHREVO jointly launched the CODE AI Programmer Laptop, designed specifically for programmers. At the same time, MECHREVO showcased several of its star products, while iSoftStone featured its Tianxuan Knowledge Base and ISSEOS at the ecological cooperation exhibition area.
Exceptional Performance Debuts
Jointly Unveiling CODE AI Programmer Laptop
The new MECHREVO CODE AI Programmer Laptop was unveiled for the first time, powered by Intel's Core Ultra series processors, which combine CPU, GPU, and NPU—three AI engines—offering powerful localized computing capabilities. This dramatically enhances the laptop's performance and productivity efficiency. In addition, it is equipped with an AI developer learning suite co-developed by Intel, MECHREVO, and Zhipu AI. This suite provides AI developers with a full-cycle set of tools, from deployment and learning to hands-on development.
The MECHREVO CODE AI Programmer Laptop comes pre-installed with Zhipu AI's CodeGeeX NANO, a smart programming assistant based on a local large model. It helps with tasks such as code generation and completion, automatically adding comments to code, enabling cross-language code translation, intelligent Q&A for technical and code-related issues, code explanation, unit test generation, code review, and bug fixes—among many other features. Most importantly, all of these functions can run entirely on local computing power, leveraging the Core Ultra processor within the CODE AI Programmer Laptop.
With its outstanding performance, excellent display, and portable design, the MECHREVO CODE AI Programmer Laptop is expected to become one of the top choices for programmers.
Exciting Display at the Ecological Cooperation Exhibition Area
Partnering to Accelerate Industry Transformation
At the conference, MECHREVO showcased its latest AI PC series based on Intel Core Ultra processors, as well as its high-performance mobile solutions powered by the 14th Gen Core HX processors. In addition, iSoftStone's Tianxuan Knowledge Base and ISSEOS were also prominently displayed at the exhibition area.
MECHREVO's Forza and Aurora Series High-Performance Laptops
Equipped with the 14th Gen Core HX processors, these laptops deliver an impressive release of performance, with an abundance of cores and extremely high frequencies. The groundbreaking heterogeneous architecture intelligently allocates threads to achieve better performance at lower power consumption. With the support of a next-generation cooling system, these laptops ensure sustained full-performance output. The high-refresh-rate gaming screen and full-sized keyboard offer users a perfect experience, from visual appeal to seamless control.
iSoftStone Tianxuan Knowledge Base
Tianxuan Knowledge Base is an AI product that integrates advanced natural language processing, sophisticated algorithms, and deep learning models. Its goal is to efficiently and accurately extract valuable information from vast volumes of documents, providing deep understanding and intelligent search of document content, thereby offering users precise information services. Leveraging Intel's hardware acceleration and virtualization technologies, Tianxuan Knowledge Base is gradually becoming a key solution to the current information overload problem, with its high-efficiency and precise information retrieval capabilities.
iSoftStone's ISSEOS
ISSEOS is iSoftStone's proprietary commercial operating system, based on TianheOS and iSoftStone's computing hardware and software integration advantages. It incorporates Intel's hardware acceleration libraries to deliver comprehensive performance enhancements for clients. Thanks to technologies like Intel virtualization, the system can provide end-to-end solutions such as hyper-convergence and database appliances.
Earlier, iSoftStone signed a strategic cooperation agreement with Intel (China) Ltd. at the H•I³ AI Discovery Summit 2024. The two companies plan to conduct in-depth collaboration in areas such as intelligent computing center services, AIPC, and intelligent cabin. They will focus on integrating industry and research, building business ecosystems, and releasing and sharing research results at appropriate times to jointly explore vertical industry markets. This conference further solidified their partnership, as both parties aim to drive innovation and applications in smart technology and explore infinite possibilities for the future.